View source for WMED 2009

{{Event
 | Acronym = WMED 2009
 | Title = The Seventh Annual IEEE Workshop on Microelectronics and Electron Devices
 | Type = Conference
 | Series = 
 | Field = Uncategorized
 | Homepage = www.ewh.ieee.org/r6/boise/wmed2009/CFP.html
 | Start date = Apr 3, 2009 
 | End date =  Apr 3, 2009
 | City= Boise
 | State =  ID
 | Country =  USA
 | Abstract deadline = 
 | Submission deadline = Jan 26, 2009
 | Notification = Feb 13, 2009
 | Camera ready = Feb 20, 2009
}}

<pre>
The Seventh Annual IEEE Workshop on Microelectronics and Electron Devices will provide a forum for reviewing and discussing all aspects of microelectronics including processing, electrical characterization, design and new device technologies. This symposium will consist of both invited and contributed talks and papers as well as a poster session throughout the afternoon. Faculty, students, and researchers in industry are encouraged to contribute presentations on either completed research or "work-in-progress" research. Topics are in the following areas that will form the contributing sessions and poster sessions in the workshop program:

Microelectronic Device Processing and Process Integration

- Trends in submicron technologies; product development (DRAM, SRAM, Flash, CMOS Imagers); new device technologies (Phase Change Memory, Resistive Memory, Ferroelectric Memory, Nano-electronics), novel transistors, device improvements.

Microelectronic Device Electrical and Reliability Testing

- Dielectric reliability; device reliability; phase change memory reliability; novel memory technology testing schemes; electrical properties of novel devices.

Semiconductor Packaging and Reliability

- Semiconductor package reliability, Design for Manufacturability, and stacked die packaging, and novel assembly processes. Novel packaging structures, processes, and materials.

Microelectromechanical Systems (MEMS)

- Novel processes and materials, MEMS research, development and performance.

Microelectronic Circuit Design

- New product design, design techniques, and memory sensing schemes.

 

IEEE WMED Manuscript Submission Process

An IEEE Publication of the accepted papers and a CD-ROM including the papers and presentations is planned and will be available at the start of the workshop.  Submitted manuscripts will be limited to four pages and should follow the IEEE Electron Device Letters publication format guidelines.  

Download sample Microsoft Word Template

For a more detailed manuscript preparation instructions can be downloaded at: http://www.ieee.org/portal/cms_docs/pubs/transactions/auinfo03.pdf

Please submit your IEEE-formatted four-page manuscript by January 26th, 2008 to the 2009 IEEE WMED Publications Chair, ssurthi@micron.com, 208-368-1773.

Questions concerning the conference, paper content, or the paper submission process can be directed to: Shyam Surthi, 2009 IEEE WMED General Chair, ssurthi@micron.com, 208-368-1773.

Important Workshop Dates

January 26, 2009: Manuscript Submission Deadline

February 13, 2009: Acceptance Notification

February 20, 2009: Final Manuscript Submission

March 16, 2009: Deadline for Advance Registration

March 20, 2009: Presentation Submission Deadline

April 03, 2009: Workshop
	</pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3708&amp;copyownerid=2 WikiCFP]
Acronym	WMED 2009 +
Camera ready due	February 20, 2009 +
End date	April 3, 2009 +
Event type	Conference +
Has coordinates	43° 37' 0", -116° 12' 3"Latitude: 43.616616666667 Longitude: -116.20088611111 +
Has location city	Boise +
Has location country	Category:USA +
Has location state	ID +
Homepage	http://www.ewh.ieee.org/r6/boise/wmed2009/CFP.html +
IsA	Event +
Notification	February 13, 2009 +
Start date	April 3, 2009 +
Submission deadline	January 26, 2009 +
Title	The Seventh Annual IEEE Workshop on Microelectronics and Electron Devices +