Edit Event: SMMP2023

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The 2nd International Conference on Smart Manufacturing and Material Processing (SMMP2023) invites the submission of original research papers in the fields of material sciences and smart manufacturing to be published in the conference proceedings. The response to our Call for Papers this year was great and we received proposals from all over the world. Now SMMP2023 has decided to extend the submission deadline. AND EVEN BETTER is that selected excellent papers will enjoy an excellent discount. ==Topics== 1. Smart Manufacturing Technology Intelligent control system Computer integrated manufacturing system Advanced control and Optimization Technology Applications of AI Techniques in Design and Manufacturing New Sensing Technology Precision ultra-precision machining technology Laser processing technology Intelligent Manufacturing Technology Additive Manufacturing and materials processing Technology Advanced Manufacturing Production Mode Virtual Manufacturing and Network Manufacturing System Analysis and Industrial Engineering Microelectronics packaging, testing and manufacturing technology Industrial robots and automatic production line 2. Manufacturing Processes and Systems Material processing and forming Surface Engineering/Coating Tribology in Manufacturing Processes Quality Monitoring and Control of the Manufacturing Process E-manufacturing, ERP, and Integrated Factory Operations, and Production Management Machinery control and information processing technology Precision Engineering, and Concurrent Engineering Engineering Optimization 3. Materials Processing Engineering Polymer Materials Metamaterial structure design Structural strength, fatigue and stability Polymer Processing Super Alloys Advanced metal forming, bending, welding & casting techniques Fabrication Process of Nano materials and Nano devices Advanced machining processes Recycling and re-manufacturing of Materials and Components Microwave Processing of Materials Thermal Engineering Theory and Applications Thermally-Enhanced Processes and Materials Material calculation and numerical simulation ==Submissions== All submissions must be in English with a varying length from 4 to 10 pages including figures and references, adhere to the template format in the conference website, and must be submitted to conference email address: contact@icsmmp.org. ==Important Dates== Last date for paper submission: June 30, 2023 July 31, 2023 Last date for paper acceptance: July 31, 2023 August 15, 2023 Last date for registration: August 15, 2023 August 25, 2023 If you have to make an overdue submission, email the conference secretary at contact@icsmmp.org ==Committees== * Co-Organizers International Association of Applied Science and Technology (IAAST) Wuhan Institute of Technology Nanotechnology and Multifunctional Structures Research Center (NMSRC) * General Co-Chairs Babak Safaei, Associate Professor, Department of Mechanical Engineering, Eastern Mediterranean University, Turkey. Jinfeng Wang, Professor, School of Management Engineering, Zhengzhou University, China. * Technical Committee members Aleksandar Rikalović, University of Novi Sad, Serbia Adil Tamimi, University of Strathclyde, Scotland Afshin Abrishamkar, McMaster University, Canada Arkadiusz Gola, Lublin University of Technology, Poland Bruce Jo, ADAMS Laboratory, USA Chenwei Shao, Chinese Academy of Sciences, China David Bassir, Universitéde Technologies de Belfort-Montbéliard, France Dawei Jiang, Northeast Forestry University, China Edgar Alfonso Chacón Ramírez, Universidad de los Andes, Venezuela Eng. Rositsa Petkova-Slipets, VFU "Chernorizets Hrabar", Bulgaria Himansu Sekhar Nanda, PDPM-Indian Institute of Information Technology, Design & Manufacturing Jabalpur, India Izabela Major, Czestochowa University of Technology, Poland Jieshan Qiu, Dalian University of Technology, China Jai Prakash, National Institute of Technology (NIT) Hamirpur , India Jinlian HU, City University of Hong Kong, China Jun Lei，Beijing University of Technology，China Junwei Zha, University of Science and Technology Beijing, China Kamila Kotrasová, Technical University of Košice, Slovak Republic Martina Zelenakova, Technical University of Kosice, Slovakia Martin Krejsa, Technical University of Ostrava, Republic Czechia Mehmet AVCAR, Süleyman Demirel University, Turkey Mohammed Bsher A. Asmael, Eastern Mediterranean University, Cyprus Peng Zhao, Zhejiang University, China Quanle Zou, Chongqing University, China Rekha Raja, University of California Davis (UCD), California, USA Sadettin Cem Altıparmak‬, Imperial College London, UK Samuel Abejide, Walter Sisulu University, South Africa Suriani Mat Jusoh, Universiti Malaysia Terengganu, Malaysia Tokeer Ahmad, Jamia Millia Islamia, India Tien-Chien Jen, University of Johannesburg; South Africa Voon Loong Wong, Heriot-Watt University, Malaysia Wenlong Li, Huazhong University of Science and Technology, China Xiaoxiao Meng, Harbin Institute of Technology, China Yupiter HP Manurung, UiTM Shah Alam, Malaysia

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