NAECON 2009
NAECON 2009 | |
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National Aerospace & Electronics Conference 2009
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Dates | Jul 21, 2009 (iCal) - Jul 23, 2009 |
Homepage: | www.naecon.org/index.html |
Location | |
Location: | Dayton, Oh |
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Important dates | |
Submissions: | May 4, 2009 |
Camera ready due: | Jun 19, 2009 |
Table of Contents | |
NAECON (National Aerospace and Electronics Conference) is the oldest and premier IEEE Conference presenting research in all aspects of theory, design, and applications of aerospace systems and sensors. It is jointly sponsored by Dayton Section IEEE and The Aerospace & Electronics Systems Society (AESS). NAECON 2009's theme is “Next Generation Optics & Futuristic RF Applications” with Keynote Speaker, Dr. Paul McManamon and numerous Plenary speakers. NAECON 2009 is exploring the following areas: Optics, Radar/LIDAR, Innovative Aerospace Materials, Plasmonic Devices, Intelligent Sensory Exploitation, RF Reconfigurable Nanotechnology, Wireless & Information Interoperability, Waveform Diversity and Core Intelligent Aerospace Sensor Integration. The conference will continue a series of “NAECON Grand Challenge Problems”, this year being “Signals of Opportunity. Teams for the NAECON Grand Challenge will present research at The Ohio Innovation Summit OIS 09 (Formerly Ohio Nanotechnology Summit) on April 22, 2009 at the Dayton Convention Center. Three finalists will be chosen for NAECON 2009 presentations, with final papers being due for the NAECON conference. NAECON ‘09 Conference date is 21-23 July 2009, at the Holiday Inn, Fairborn, Ohio.
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Facts about "NAECON 2009"
Acronym | NAECON 2009 + |
Camera ready due | June 19, 2009 + |
End date | July 23, 2009 + |
Event type | Conference + |
Has coordinates | 39° 45' 32", -84° 11' 30"Latitude: 39.758947222222 Longitude: -84.191605555556 + |
Has location city | Dayton + |
Has location country | Category:USA + |
Has location state | OH + |
Homepage | http://www.naecon.org/index.html + |
IsA | Event + |
Start date | July 21, 2009 + |
Submission deadline | May 4, 2009 + |
Title | National Aerospace & Electronics Conference 2009 + |