SenSys 2019

SenSys 2019
17th ACM Conference on Embedded Networked Sensor Systems (SenSys 2019)
Event in series	SenSys
Dates	2019/11/10 (iCal) - 2019/11/13
Homepage:	http://sensys.acm.org/2019/
Twitter account:	@sensys_acm
Submitting link:	https://sensys19.hotcrp.com/
Location
Location:	New York City, New York, USA
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Important dates
Abstracts:	2019/04/05
Submissions:	2019/04/12
Notification:	2019/07/23
Camera ready due:	2019/09/20
Registration link:	http://www.cvent.com/events/acm-sensys-buildsys-19/event-summary-7c4a3fdd358d4034a6d662110b1bfe96.aspx
Early bird student:	$ 410 / {{{Early bird fee reduced}}} Property "Early bird fee reduced" (as page type) with input value "{{{Early bird fee reduced}}}" contains invalid characters or is incomplete and therefore can cause unexpected results during a query or annotation process. (reduced)
On site student:	$ 435 / {{{On site fee reduced}}} Property "On site fee reduced" (as page type) with input value "{{{On site fee reduced}}}" contains invalid characters or is incomplete and therefore can cause unexpected results during a query or annotation process. (reduced)
Early bird regular:	$ 860
On site regular:	$ 960
Committees
Organizers:	ACM
General chairs:	Raghu K. Ganti, Xiaofan (Fred) Jiang
PC chairs:	Gian Pietro Picco, Xia Zhou
Workshop chairs:	Akshay Uttama Nambi S N
Table of Contents
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The 17th ACM Conference on Embedded Networked Sensor Systems (SenSys 2019) introduces a highly selective, single-track forum for research on systems issues of sensors and sensor-enabled smart systems, broadly defined. Systems of smart sensors will revolutionize a wide array of application areas by providing an unprecedented density and fidelity of instrumentation. They also present various systems challenges because of resource constraints, uncertainty, irregularity, mobility, and scale. This conference provides an ideal venue to address research challenges facing the design, development, deployment, use, and fundamental limits of these systems. Sensing systems require contributions from many fields, from wireless communication and networking, embedded systems and hardware, energy harvesting and management, distributed systems and algorithms, data management, and applications, so we welcome cross-disciplinary work.

Committees

• Co-Organizers
• General Co-Chairs
  • Raghu K. Ganti, IBM T.J. Watson, USA
  • Xiaofan (Fred) Jiang, Columbia University, USA

• PC Co-Chairs
  • Gian Pietro Picco,University of Trento, Italy.
  • Xia Zhou,Dartmouth College, USA.

• Workshop Chair
  • Akshay Uttama Nambi S N, Microsoft Research, India.
  • Chenren Xu,Peking University, China.

• Demonstration Co-Chairs
  • some person, some affiliation, country
  • some person, some affiliation, country

• Local Arrangements Chair
  • Tingjun Chen, Columbia University, USA.