SENSORCOMM 2009
| SENSORCOMM 2009 | |
|---|---|
The Third International Conference on Sensor Technologies and Applications
| |
| Subevent of | NetWare 2009 |
| Dates | 2009/06/14 (iCal) - 2009/06/19 |
| Homepage: | www.iaria.org/conferences2009/SENSORCOMM09.html |
| Location | |
| Location: | Athens, Greece |
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| Important dates | |
| Submissions: | 2009/01/20 |
| Notification: | 2009/02/25 |
| Camera ready due: | 2009/03/20 |
| Table of Contents | |
The Third International Conference on Sensor Technologies and Applications
The SENSORCOMM 2009 (The Third International Conference on Sensor Technologies and Applications) is a multi-track event covering related topics on theory and practice on wired and wireless sensors and sensor networks.
Sensors and sensor networks have become a highly active research area because of their potential of providing diverse services to broad range of applications, not only on science and engineering, but equally importantly on issues related to critical infrastructure protection and security, health care, the environment, energy, food safety, and the potential impact on the quality of all areas of life.
As a multi-track event, SENSORCOMM 2009 will serve as a forum for researchers from the academia and the industry, professionals, standard developers, policy makers and practitioners to exchange ideas. The topics could be on techniques and applications, best practices, awareness and experiences as well as future trends and needs (both in research and practices) related to all aspects of information security, security systems and technologies.
Sensor networks and sensor-based systems support many applications today on the ground. Underwateroperations and applications are quite limited by comparison. Most applications refer to remotely controlled submersibles and wide-area data collection systems at a coarse granularity.
The conference has the following independents tracks:
- APASN: Architectures, protocols and algorithms of sensor networks
- MECSN: Energy, management and control of sensor networks
- RASQOFT: Resource allocation, services, QoS and fault tolerance in sensor networks
- PESMOSN: Performance, simulation and modelling of sensor networks
- SEMOSN: Security and monitoring of sensor networks
- SECSED: Sensor circuits and sensor devices
- RIWISN: Radio issues in wireless sensor networks
- SAPSN: Software, applications and programming of sensor networks
- DAIPSN: Data allocation and information in sensor networks
- DISN: Deployments and implementations of sensor networks
We welcome technical papers presenting research and practical results, position papers addressing the pros and cons of specific proposals, such as those being discussed in the standard fora or in industry consortia, survey papers addressing the key problems and solutions on any of the above topics short papers on work in progress, and panel proposals.
The topics suggested by the conference can be discussed in term of concepts, state of the art, standards, implementations, running experiments and applications. Authors are invited to submit complete unpublished papers, which are not under review in any other conference or journal in the following, but not limited topic areas. Industrial presentations are not subject to these constraints. Tutorials on specific related topics and panels on challenging areas are encouraged.
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INSTRUCTION FOR THE AUTHORS
The SENSORCOMM 2009 Proceedings will be published by IEEE Computer Society Press and on-line via IEEE XPlore Digital Library. IEEE will index the papers with major indexes. Authors of selected papers will be invited to submit extended versions to one of the IARIA Journals.
- Important deadlines:
- Submission (full paper): January 20, 2009
- Authors notification: February 25, 2009
- Registration: March 15, 2009
- Camera ready: March 20, 2009
Only .pdf or .doc files will be accepted for paper submission. All received papers will be acknowledged via an automated system.
Final author manuscripts will be 8.5" x 11" (two columns IEEE format), not exceeding 6 pages; max 4 extra pages allowed at additional cost. The formatting instructions can be found on the Instructions page. Helpful information for paper formatting can be found on the here.
Once you receive the notification of paper acceptance, you will be provided by the IEEE CS Press an online author kit with all the steps an author needs to follow to submit the final version. The author kits URL will be included in the letter of acceptance.
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Technical marketing/business/positioning presentations
The conference initiates a series of business, technical marketing, and positioning presentations on the same topics. Speakers must submit a 10-12 slide deck presentations with substantial notes accompanying the slides, in the .ppt format (.pdf-ed). The slide deck will be published in the conference’s CD collection, together with the regular papers. Please send your presentations to petre@iaria.org.
Tutorials
Tutorials provide overviews of current high interest topics. They should be about three hours long. One page with the title, tutorial summary, and a short bio are expected. Please send your proposals to petre@iaria.org
Panel proposals
The organizers encourage scientists and industry leaders to organize dedicated panels dealing with controversial and challenging topics and paradigms. Panel moderators are asked to identify their guests and manage that their appropriate talk supports timely reach our deadlines. Moderators must specifically submit an official proposal, indicating their background, panelist names, their affiliation, the topic of the panel, as well as short biographies.
For more information, petre@iaria.org [url=http://www.inmassage.net Full Service in nanjing]
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Committees
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SENSORCOMM 2009 General Chairs
- Athanasios Vasilakos, University of Western Macedonia, Greece
SENSORCOMM 2009 Industrial Chairs
- Saied Abedi, Fujitsu Laboratories of Europe LTD. (FLE)-Middlesex, UK
- Steven Corroy, Philips Research Europe – Eindhoven, The Netherlands
- Jianlin Guo, Mitsubishi Electric Research Laboratories America, USA
SENSORCOMM 2009 Publicity Chair
- Habib M. Ammari, Hofstra University, USA
- Yacine Benallouche, Université de Versailles Saint-Quentin, France
SENSORCOMM 2009 Technical Program Committee
- Chairs:
- Younzi Xu, Jonkoping University, Sweden
- Merja Tikkakoshi, Beamex, Finland
- Radosveta Sokkulu, Ege University - Izmir, Turkey
- Winston KG Seah, Institute for Infocomm Research (Member of A*STAR), Singapore
- Zhen Liu, Nokia Research – Palo Alto, USA
- Members:
- Saied Abedi, Fujitsu Laboratories of Europe LTD. (FLE)-Middlesex, UK
- Alex Alagarsamy Aravind, University of Northern British Columbia, Canada
- Boushra Alkubeily, Univerité de Technology de Compiègne, France
- Ozgur Baris Akan, Middle East Technical University-Ankara, Turkey
- Miguel Ardid Ramirez, Polytechnic University of Valencia, Spain
- Habib M. Ammari, Hofstra University, USA
- Nauman Aslam, Dalhousie University - Halifax, Canada
- Marcelo Azambuja, PUCRS University/Porto Alegre City, FACCAT /Taquara City, Brazil
- Reza Azarderakhsh, The University of Western Ontario - London, Canada
- Tarun Bansal, University of Texas at Dallas, USA
- Novella Bartolini, "Sapienza" University of Rome, Italy
- Rezaul K Begg, Victoria University - City Flinders Campus/Melbourne, Australia
- Paolo Bellavista, Università di Bologna, Italy
- Yacine Benallouche, Université de Versailles Saint-Quentin, France
- Peter Bertok, RMIT University-Melbourne, Australia
- Hatem Bettahar, Université de Technologie de Compiègne, France
- Alessandro Bogliolo, University of Urbino, Italy
- Stefan Bouckaert, Ghent University - IBBT, Belgium
- Bart Braem, University of Antwerp, Belgium
- Lina Brito, University of Madeira (UMa)/Campus da Penteada-Funchal, Portugal
- Konstantin Busch, Louisiana State University - Baton Rouge, USA
- Tiziana Calamoneri, “La Sapienza” Università di Roma, Italy
- Chen Canfeng (David), Nokia Research Center, Beijing, China
- Maria Dolores Cano Banos, Polytechnic University of Cartagena - Campus Muralla del Mar, Spain
- Juan Vicente Capella Hernández, Universidad Politécnica de Valencia, Spain
- Chih-Yung Chang, Tamkang University, Taiwan
- Ioannis Chatzigiannakis, University of Patras, Greece
- Jiming Chen, Zhejiang University - Hangzhou, China
- Li-Der Chou, National Central University, Taiwan
- Po-Jen Chuang, Tamkang University-Taipei, Taiwan
- Mark Coates, McGill University, Canada
- Hugo Coll Ferri, Polytechnic University of Valencia
- Doru Constantin, University of Pitesti, Romania
- Steven Corroy, Philips Research Europe – Eindhoven, The Netherlands
- Alfredo Cuzzocrea, ICAR Institute and University of Calabria, Italy
- Ranjan Dasgupta, Tata Consultancy Services, India
- Luis de la Cruz, Technical University of Catalonia, Spain
- Jerker Delsing, Luleå University of Technology, Sweden
- Eli De Poorter, Ghent University - IBBT, Belgium
- P. S. Dhekne, Indian National Academy of Engineering, India
- Hristo Djidjev, Los Alamos National Laboratory, USA
- Mari Carmen Domingo, Technical University of Catalonia - Barcelona, Spain
- Juan C. Dueñas, ETSIT-Universidad Politécnica de Madrid, Spain
- Xiang Fei, University of Stirling, UK
- Huei-Wen Ferng, National Taiwan University of Science and Technology - Taipei, Taiwan
- Armando Ferro, University of the Basque Country (UPV/EHU), Spain
- Giancarlo Fortino, Università della Calabria, Italy
- Thomas Fuhrmann, University of Karlsruhe, Germany
- Manel Gasulla, Universitat Politècnica de Catalunya (UPC), Spain
- Hamid Gharavi, National Institute of Standards and. Technology (NIST) - Gaithersburg, USA
- Joao Pedro Gomes, Instituto Superior Técnico (IST) - Lisbon, Portugal
- Jianlin Guo, Mitsubishi Electric Research Laboratories America, USA
- Ismo Hakala, University of Jyväskylä, Kokkola University Consortium Chydenius, Finland
- Seán Harte, Ireland, University College Cork Ireland / Tyndall National Institute, Ireland
- Yanxiang He, Wuhan University, P.R.China
- Jens Martin Hovem, Norwegian University of Science and Technology, Norway
- Vincent Huang, Ericsson AB, Sweden
- Abhaya Induruwa, Canterbury Christ Church University, UK
- Kamrul Islam, Queen's University, Canada
- Weijia Jia, City University of Hong Kong, Hong Kong SAR, China
- Liu Jian, Nihon University, Japan
- Zhen Jiang, West Chester University, USA
- Constantine Kakoyiannis, National Technical University of Athens, Greece
- Kyoung-Don Kang, State University of New York – Binghamton, USA
- Reinhardt Karnapke, Brandenburg University of Technology - Cottbus, Germany
- Andreas J Kassler, Karlstad University, Sweden
- Tan Kok Kiong, National University of Singapore, Singapore
- Alexey A. Kiryushin, University of Nizhny - Novgorod, Russia
- Kostas Konstantinos, Kings College London, UK
- Evangelos Kranakis, Carleton University - Ottawa, Canada
- Kae-Hsiang Kwong, University of Stratchlyde, UK
- Benoît Latré, Ghent University – IBBT, Belgium
- Hung-Cuong Le, University of Franche Comté, France
- Heesang Lee, Sungkyunkwan University-Suwon, Korea
- Tsern-Huei Lee, National Chiao Tung University, Taiwan
- Johannes Lessmann, NEC Europe Ltd - Heidelberg, Germany
- Yingshu Li, Georgia State University, USA
- Chiu-Kuo Liang, Chung Hua University, Taiwan, R.O.C.
- Qilian Liang, University of Texas at Arlington, USA
- Weifa Liang, Australian National University-Canberra, Australia
- Chih-Yu Lin, Asia University, Taiwan
- Thomas Lindh, STH/KTH - Haninge, Sweden
- Thomas Little, Boston University, USA
- Alireza Masum, Urmia University of Technology, Iran
- Ingrid Moerman, Ghent University – IBBT, Belgium
- Hai Liu, Hong Kong Baptist University, Hong Kong
- Zhen Liu, Nokia Research – Palo Alto, USA
- Seng Loke, La Trobe University, Australia
- Elsa María Macías López, University of Las Palmas de Gran Canaria, Spain
- Chung-Horng Lung, Carleton University-Ottawa, Canada
- Sajjad A. Madani, COMSATS/Institute of Information Technology – Abbottabad, Pakistan
- Abdallah Makhoul, Université de Franche-Comté, France
- Gunnar Mathiason, University of Skövde, Sweden
- Natarajan Meghanathan, Jackson State University, USA
- Geyong Min, University of Bradford, UK
- Nader faisal Mohamed, UAE University, UAE
- Sohrab Monsi, University of Kassel, Germany
- Amiya Nayak, University of Ottawa, Canada
- Arye Nehorai, Washington University in St. Louis, USA
- Michael Niedermayer, Fraunhofer Institute for Reliability and Microintegration, Germany
- Frank Oldewurtel, RWTH Aachen University, Germany
- Vladimir Oleshchuk, University of Agder, Norway
- Carlos Enrique Palau Salvador, Polytechnic University of Valencia, Spain
- Nikolaos A. Pantazis, Technological Educational Institution (TEI) of Athens, Greece
- Maria Cristina Pinotti, Università degli Studi di Perugia, Italy
- Miodrag Potkonjak, University of California – Los Angeles, USA
- Uvais Qidwai, Qatar University - Doha, Qatar
- Robert Qiu, Tennessee Tech University, USA
- Candid Reig, Universitat de València, Spain
- Juan Reig Pascual, Technical University of Valencia/iTEAM, Spain
- Joel Rodrigues, University of Beira Interior, Portugal
- Markku Rossi, Mikkeli University of Applied Sciences, Finland
- Nirmalya Roy, The University of Texas at Austin, USA
- Lorenzo Rubio Arjona, Polytechnical University of Valencia, Spain
- Pedro M. Ruiz, University of Murcia - Campus de Espinardo s/ n, Spain
- Addisson Salazar, Polytechnic University of Valencia, Spain
- Mikko Sallinen, VTT/Technical Research Centre of Finland – Oulu, Finland
- Francisco Javier Sánchez Bolumar, Polytechnic University of Valencia, Spain
- Christian Schindelhauer, University of Freiburg, Germany
- Khoon Guan Winston Seah, Institute for Infocomm Research (Member of A*STAR), Singapore
- Ashok Kumar Chandra Sekaran, University of Karlsruhe, Germany
- Michael Segal, Ben-Gurion University of The Negev - Beer-Sheva, Israel
- Leo Selavo, University of Latvia, Latvia
- Maria Jose Serna, Universitat Politecnica de Catalunya-Barcelona, Spain
- Kuei-Ping Shih, Tamkang University-Taipei, Taiwan
- Harkirat Singh, Samsung Electronics Co., Korea
- Radosveta Sokkulu, Ege University - Izmir, Turkey
- Peter Soreanu, Braude College of Engineering - Karmiel, Israel
- Peter Spies, Fraunhofer Institut Integrierte Schaltungen IIS, Germany
- Tsenka Stoyanova, University of Patras, Greece
- Radu Stoleru, Texas A&M University, USA
- Junzhao Sun, University of Oulu, Finland
- Zahra Taghikhaki, University of Science and Technology, Iran
- Liansheng Tan, The Australian National University – Canberra, Australia
- Dimitris K. Tasoulis, Imperial College London, UK
- Rui Teng, National Institute of Information and Communication Technology - Kyoto, Japan
- Lothar Thiele, Swiss Federal Institute of Technology (ETH-Zurich, Switzerland
- Merja Tikkakoshi, Beamex, Finland
- Neeta Trivedi, Aeronautical Development Establishment- Bangalore, India
- Evy Troubleyn, Ghent University, Belgium
- Yu-Chee Tseng, National Chiao-Tung University / Hsin-Chu, Taiwan
- Maurizio Valle, University of Genoa, Italy
- Jan van Leeuwen, Universiteit Utrecht, The Netherlands
- Natalija Vlajic, York University - Toronto, Canada
- Eli Upfal, Brown University, USA
- Fabrice Valois, INSA-Lyon, France
- Jean Philippe Vasseur, Cisco Systems, Inc., France
- Roberto Verdone, Università di Bologna & IEIIT-BO, CNR & CNIT, Italy
- Brijesh Verma, CQUniversity, Australia
- You-Chiun Wang, National Chiao-Tung University, Taiwan
- Yufeng Wang, Nanjing University of Posts and Telecommunications, China
- Thomas Watteyne, Orange Labs, France
- Andreas Willig, Technical University Berlin, Germany
- Hongyi Wu, University of Louisiana at Lafayette, USA
- Younzi Xu, J nk ping University, Sweden
- Dongfang Yang, National Research Council Canada – London, Canada
- Qiang Ye, University of Prince Edward Island, Canada
- Santiago Zazo Bello, Universidad Politecnica de Madrid, Spain
- Hongwei Zhang, Wayne State University - Detroit, USA
- Wang Zhi, Zhejiang University, China
- Tanveer Zia, Charles Sturt University, Australia
