APEC 2021

APEC 2021
IEEE Applied Power Electronics Conference and Exposition
Event in series	APEC
Dates	2021/03/21 (iCal) - 2021/03/25
Homepage:	http://www.apec-conf.org/
Submitting link:	https://epapers.org/apec2021/ESR/login.php
Location
Location:	Phoenix, Arizona, USA
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Important dates
Papers:	2020/08/14
Submissions:	2020/08/14
Notification:	2020/10/28
Committees
General chairs:	Conor Quinn
Table of Contents

APEC is the leading conference for practicing power electronics professionals and addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.

Important Milestones (subject to change): June 8, 2020: Digest submission site opens August 14, 2020: Deadline for submission of digests October 28, 2020: Notification that a paper was accepted or declined November 20, 2020: Final papers and author registrations are due

• Topics of Interest:
• AC-DC Converters:
• Single-Phase and Three-Phase Input
• Power Factor Correction, CCM, DCM, CRM/BCM Control, Bridgeless
• Embedded AC-DC Power Supplies
• External AC-DC Adapters
• Bidirectional ac/dc converters
• DC-DC Converters:
• Hard- and Soft-Switched
• Resonant Converterers
• Point-of-Load (PoL) and Multi-Phase Converters
• Voltage Regulator Modules (VRM)
• Bidirectional dc/dc converters
• Power Electronics for Utility Interface:
• Power Generation, Transmission and Distribution
• Power Quality, UPS, Filters
• Distributed Energy Systems
• SmartGrid
• UPS
• Solid-State Transformers
• Metering
• Bidirectional grid interface converters
• Motor Drives and Inverters:
• AC, DC, BLDC Motor Drives
• Single- and Multi-Phase Inverters
• Sensor Integration
• Actuators
• High Performance Drives
• Devices and Components:
• Power Silicon MOSFETs, BJTs, IGBTs
• GaN HEMTs,
• SiC MOSFETs and BJTs
• Fast Recovery Diodes
• Magnetic Materials and Components
• Capacitors, Supercapacitors
• Interconnects and Fuses
• Power Electronics Integration and Manufacturing:
• Power Electronics Packaging
• Power Modules / High Density Design
• Thermal and EMC Management
• Quality and System Reliability
• Embedding technologies, 3D packaging, and additive manufacturing
• Production Processes and Design for Manufacturability
• Modeling and Simulation:
• Circuits and Systems
• Device and Component Modeling
• Parasitics
• Software Tools
• Rapid Prototyping
• Control:
• Control of Power Electronic Converters
• Current-Mode and Voltage-Mode Control
• Digital Control
• Sensor and Sensor-less Control
• Gate Drive Circuits
• Control ICs
• MCUs, DSPs, FPGAs, ASICs
• Wireless Power Transfer:
• Wireless charging
• Energy harvesting
• Power for IoT
• Non-contact Sensors for Power Electronics
• Renewable Energy Systems:
• Photovoltaic (PV) Inverters and Micro Inverters
• Maximum power point tracking (MPPT)
• Wind Energy Conversion Systems
• Fuel Cells
• Grid-Tied Systems
• Bi-directional Power Converters
• Microgrid Systems
• Energy Storage Systems
• Transportation Power Electronics:
• Vehicular Power Electronic Circuits and Systems
• Power Electronics for Hybrid and Electric Cars
• Power Electronics for Aerospace
• Charging Systems
• Power Electronics Applications:
• Lamp Ballasts and LED Lighting
• Network and Telecommunication Power Electronics
• Defense and Military Power Electronics
• AC-DC-AC Applications and Matrix Converters
• Portable Power
• Energy Harvesting
• Magnetics
• Electric machines
• Advanced magnetic materials and geometries
• Magnetics applications
• High-frequency magnetics
• Additive manufacturing
• Magnetics modeling and simulations