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  • DESI 2008
    - New types of materials, including informal language (e.g., in Stephen Mason, Institute of Advanced Legal Studies
    4 KB (610 words) - 13:22, 27 November 2020
  • M3 2011
    |Title=Annual International Conference on Materials Science, Metal and Manufacturing Annual International Conference on Materials Science, Metal and Manufacturing (M3 2011)
    4 KB (424 words) - 09:39, 24 June 2011
  • META 2008
    | Title = NATO Advanced Research Workshop: Metamaterials for Secure Information and Communication T ...ction of a diverse spectrum of electrical, microwave, infrared and optical materials and devices.
    2 KB (276 words) - 22:20, 14 October 2008
  • SysML 2008
    Sponsored by USENIX, the Advanced Computing Systems Association Registration Materials
    6 KB (837 words) - 22:21, 14 October 2008
  • ULIS 2009
    ...earch in technology, physics, modeling, simulation and characterization of advanced nanoscale silicon and silicon compatible devices in the More Moore, More th ...electronics: strained Si, strained SOI, SiGe, GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devi
    4 KB (507 words) - 22:21, 14 October 2008
  • IWCE 2009
    The workshop covers all aspects of advanced simulation of electronic bandstructure nano-materials, optoelectronic and organic devices and sensors are also included. The
    3 KB (385 words) - 22:21, 14 October 2008
  • ASMC 2009
    | Title = IEEE/SEMI Advanced Semiconductor Manufacturing Conference The 20th Annual IEEE/SEMI® Advanced Semiconductor Manufacturing Conference (ASMC 2009)
    4 KB (554 words) - 22:21, 14 October 2008
  • IWDTF 2008
    ...gate stacks, which include metal gate electrodes and high-mobility channel materials, will also be discussed. The IWDTF will provide a great opportunity for inf
    4 KB (642 words) - 22:21, 14 October 2008
  • IITC 2008
    ...um for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exc Exhibits/Seminars: New products, processes, analytical methods and materials will be exhibited at the conference on June 4 and 5. Supplier seminars will
    6 KB (798 words) - 22:22, 14 October 2008
  • IPTA 2008
    ...rocessing theory and tools, for attending extensive educational high level materials, sharing their achievements, exchanging their experiences and discussing fu ...mage processing fundamental theory, specific medical imaging applications, advanced prototypes, tools and methodologies are welcomed. Demonstrations are intens
    4 KB (475 words) - 22:25, 14 October 2008
  • NIF 2008
    Leveraging Nanotech-Enabled Applications and Advanced Materials for Business and Investment Opportunities ...financing the global economy's nanotech-enabled applications and advanced materials.
    4 KB (456 words) - 22:28, 14 October 2008
  • ANM 2008
    | Title = 2nd International Conference on Advanced Nano Materials The aim of the 2nd International Conference on Advanced Nano Materials (ANM 2008) is to bring together eminent researchers from both academia and
    2 KB (209 words) - 16:00, 27 December 2015
  • Solar 2008
    ...esting Systems, Supramolecular Nanomaterials and Lithography, Polymers and Materials, etc. - Advanced Oxidation Technologies For Treatment of Water, Air And Soil.
    6 KB (742 words) - 22:30, 14 October 2008
  • FEM 2008
    * Advanced FEM Techniques: Formulations, Solvers, Discrete Representations * FEM Applications: Antennas, Materials and Meta-materials, Bio-electromagnetics, Electromagnetic Compatibility, Circuits and Circuit
    2 KB (190 words) - 22:39, 14 October 2008
  • RadarConf 2009
    Advanced concepts and implementations in terrestrial, shipborne, airborne, ground-ba ...of-the-art signal processing components, materials (including chiral, meta-materials, and others), manufacturing techniques and packaging, distributed processin
    5 KB (625 words) - 19:19, 23 June 2020
  • ISAPE 2008
    E2. Absorbing Materials F12. Advanced Process, Packaging and Integration Technologies
    4 KB (564 words) - 22:41, 14 October 2008
  • ECTC 2009
    - Advanced Packaging: Design,development,fabrication,testing,and characterization of advanced packaging and novel component integration technologies involving elec-
    7 KB (1,023 words) - 22:41, 14 October 2008
  • ISC 2009
    Advanced Input Modeling, Simulation Optimization, Cross Entropy, Output Analysis, In ...ystems, distribution centres, inventory management, warehousing decisions, materials management, handling and packaging, logistics information systems, informat
    38 KB (4,832 words) - 16:07, 27 February 2009
  • TAROS 2009
    * Advanced applications of autonomous robots (industrial and research) * Advanced materials
    1 KB (165 words) - 20:07, 27 February 2009
  • META 2010
    ...onics. Special attention will be given to applications of these innovative materials in optical communication systems, antennas, high-speed circuits, optical se complex materials.
    2 KB (206 words) - 19:54, 27 February 2009

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