ICMEE 2021

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ICMEE 2021
6th International Conference on Mechanical and Electronics Engineering
Ordinal 6th
"th" can not be assigned to a declared number type with value 6.
Dates 2021/05/10 (iCal) - 2021/05/12
Homepage: http://icmee.org/
Submitting link: http://icmee.org/submission.html
Location
Location: Osaka, Japan
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Important dates
Submissions: 2021/04/01
Registration link: http://icmee.org/reg.html
Table of Contents


Conference Proceedings All accepted and presented papers will be published by ICMEE IOP proceedings, Materials Science and Engineering, and indexed by Scopus, etc


Conference Scope The works that will be presented and published at conference will focus on, but are not limited to, the following topics: Mechanical Engineering Acoustics and Noise Control Marine System Design Aerodynamics Material Engineering Applied Mechanics Material Science and Processing Automation, Mechatronics and Robotics Mechanical Design Automobiles Mechanical Power Engineering Automotive Engineering Mechatronics Ballistics MEMS and Nano Technology Biomechanics Multibody Dynamics Biomedical Engineering Nanomaterial Engineering CAD/CAM/CIM New and Renewable Energy CFD Noise and Vibration Composite and Smart Materials Noise Control Compressible Flows Non-destructive Evaluation Computational Mechanics Nonlinear Dynamics Computational Techniques Oil and Gas Exploration Dynamics and Vibration Operations Management Energy Engineering and Management PC guided design and manufacture Engineering Materials Plasticity Mechanics ...

Contact Ms. Serene Lo icmee@outlook.com +86-028-83208181

关于“ICMEE 2021”的事实
AcronymICMEE 2021 +
End date2021年5月12日 (三) +
Event typeConference +
Has Submitting linkhttp://icmee.org/submission.html +
Has coordinates34° 37' 12", 135° 29' 25"Latitude: 34.619880555556
Longitude: 135.49035833333
+
Has location cityOsaka +
Has location countryCategory:Japan +
Homepagehttp://icmee.org/ +
IsAEvent +
Registration linkhttp://icmee.org/reg.html +
Start date2021年5月10日 (一) +
Submission deadline2021年4月1日 (四) +
Title6th International Conference on Mechanical and Electronics Engineering +