TEI
TEI | |
---|---|
Tangible, Embedded, and Embodied Interaction
| |
CORE Rank (2017): | A |
Avg. acceptance rate: | 29.7 |
Avg. acceptance rate (last 5 years): | 29.7 |
Table of Contents | |
Tangible, Embedded, and Embodied Interaction (TEI) has an average acceptance rate of 29.7% (last 5 years 29.7%).
Events
The following events of the series TEI are currently known in this wiki:
Number of Submitted and Accepted Papers (Main Track)
0
100
200
0
100
200
132
110
130
37
36
37
Submitted papers | |
Accepted papers |
Acceptance Rate
20
30
40
20
30
40
28
32.7
28.5
Acceptance rate |
Locations
Facts about "TEI"
EventSeries acronym | TEI + |
Has Average 5y Acceptance Rate | 29.7 + |
Has Average Acceptance Rate | 29.7 + |
Has CORE Rank | A + |
IsA | EventSeries + |
Title | Tangible, Embedded, and Embodied Interaction + |