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  • CISIS 2009
    ...chnological implications in areas including robotics, actuator technology, materials,
    13 KB (1,706 words) - 15:34, 27 December 2015
  • IDC 2009
    ...ess embedded technologies, robots, accessible fabrication devices, "smart" materials, authoring/programming tools)
    5 KB (631 words) - 04:50, 14 October 2008
  • IWJT 2009
    * Silicide and Contact Technology for CMOS --- Silicide materials and salicide technology, elevated S/D, low barrier contact, surface pre-tre * Equipment, Materials and Substrates for Junction Technologies
    2 KB (281 words) - 16:32, 14 October 2008
  • ICCES 2009
    CMC: Computers, Materials, & Continua CMC: Materials by Design
    5 KB (658 words) - 16:47, 14 October 2008
  • ISTC/CSTIC 2009
    ...the-Line (FEOL), Back-End-of-the-Line (BEOL), packaging as well as silicon materials. Symposium III: New Materials and Process Integration
    3 KB (403 words) - 19:05, 14 October 2008
  • WMED 2009
    ..., and novel assembly processes. Novel packaging structures, processes, and materials. - Novel processes and materials, MEMS research, development and performance.
    3 KB (417 words) - 19:06, 14 October 2008
  • AILA 2008
    ...eacher Education (e.g. Methodology, Syllabus Design, Learning and Teaching Materials)
    3 KB (389 words) - 22:00, 14 October 2008
  • CASLA 2008
    - From the internet corpus to usable learning materials;
    9 KB (1,256 words) - 09:56, 20 November 2020
  • PsychoCompLA 2008
    other supplementary materials. Abstracts should be anonymous, clearly titled
    8 KB (1,014 words) - 22:06, 14 October 2008
  • DESI 2008
    - New types of materials, including informal language (e.g., in
    4 KB (610 words) - 13:22, 27 November 2020
  • BEA 2008
    * Automated processing of spoken and written lecture materials across * Semantic-based access to instructional materials
    6 KB (825 words) - 16:06, 27 December 2015
  • SigDial 2008
    Authors are encouraged to make illustrative materials available, on the web or otherwise. For example, excerpts of recorded conve
    5 KB (646 words) - 13:36, 15 June 2020
  • IMMERSCOM 2009
    1) title and outline of materials to be presented,
    6 KB (823 words) - 22:11, 14 October 2008
  • DESS 2008
    Materials & Processing;
    2 KB (281 words) - 23:33, 14 October 2008
  • IEEE ICCSC 2008
    - New materials, chips,and circuit designs for high-capacity, multimedia communication
    3 KB (414 words) - 22:13, 14 October 2008
  • CIAWES 2008
    ...es and their individual preferences about how they like to learn, learning materials and courses can be adapted and more accurate intelligent support can be pro
    6 KB (839 words) - 22:13, 14 October 2008
  • BOBCATSSS 2009
    ...tten. They also challenge the old ways of thinking and working. Changes in materials, the rapid increase in the use of web environments, as well as the ever inc
    3 KB (490 words) - 09:33, 7 June 2020
  • SIRTEL 2008
    - Game-theoretic approaches to select learning materials and learning partners in the long tail
    7 KB (989 words) - 22:13, 14 October 2008
  • ISPRA 2009
    Robotics materials
    8 KB (982 words) - 22:17, 14 October 2008
  • MPSVA 2009
    ...The aim of the conference is to bring together physicists, mathematicians, materials scientists and engineers from academia and industry, and to provide a platf * Composite materials
    3 KB (403 words) - 22:17, 14 October 2008

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